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Power chips are linked to outside circuits through packaging, and their performance depends upon the assistance of the product packaging. In high-power circumstances, power chips are usually packaged as power components. Chip affiliation describes the electric link on the top surface of the chip, which is usually light weight aluminum bonding wire in standard components. ^ Typical power component bundle cross-section

Today, commercial silicon carbide power components still mainly make use of the packaging technology of this wire-bonded traditional silicon IGBT component. They encounter problems such as big high-frequency parasitical parameters, insufficient heat dissipation capacity, low-temperature resistance, and inadequate insulation stamina, which restrict using silicon carbide semiconductors. The display of excellent performance. In order to resolve these troubles and totally make use of the big possible advantages of silicon carbide chips, several brand-new product packaging technologies and remedies for silicon carbide power modules have actually arised over the last few years.

Silicon carbide power component bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have developed from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold cords to copper cables, and the driving force is expense reduction; high-power gadgets have established from aluminum cables (strips) to Cu Clips, and the driving force is to boost product performance. The greater the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared with typical bonding product packaging techniques, Cu Clip technology has the following advantages:

1. The connection in between the chip and the pins is constructed from copper sheets, which, to a particular degree, replaces the conventional cable bonding technique in between the chip and the pins. As a result, a special bundle resistance value, greater existing flow, and better thermal conductivity can be acquired.

2. The lead pin welding area does not require to be silver-plated, which can completely save the expense of silver plating and bad silver plating.

3. The item appearance is entirely constant with normal items and is mainly made use of in web servers, portable computer systems, batteries/drives, graphics cards, motors, power supplies, and various other areas.

Cu Clip has two bonding methods.

All copper sheet bonding method

Both the Gate pad and the Source pad are clip-based. This bonding technique is much more pricey and complex, but it can accomplish much better Rdson and better thermal results.

( copper strip)

Copper sheet plus cable bonding technique

The resource pad uses a Clip technique, and eviction utilizes a Cord approach. This bonding approach is slightly cheaper than the all-copper bonding technique, conserving wafer area (relevant to very tiny gateway locations). The process is simpler than the all-copper bonding approach and can acquire much better Rdson and far better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding hindcopper, please feel free to contact us and send an inquiry.

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